About » Program Committee

Executive Technical Program Committee

Caglar Ataman
University of Freiburg
GERMANY

Amar Basu
Wayne State University
USA

Chun-Wen Cheng
TSMC
TAIWAN

Jae Yoong Cho
Enertia Microsystems Inc.
USA

Sabrina Conoci
University of Messina
ITALY

Isabelle Dufour
Univ. Bordeaux
FRANCE

Anpan Han
Technical University of Denmark
DENMARK

Eiji Iwase
Waseda University
JAPAN

Jack Judy
University of Florida
USA

Michael Kraft
KU Leuven
BELGIUM

Amit Lal
Cornell University
USA

Chengkuo Lee
National University of Singapore
SINGAPORE

Hyunjoo Jenny Lee
KAIST
KOREA

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Tian Li
Shanghai Institute of Microsystem and Information Technology, CAS, CHINA

Xinxin Li
Shanghai Institutue of Microsystem and Information Technology, CHINA

Ellis Meng
University of Southern California
USA

Ryo Miyake
The University of Tokyo
JAPAN

Frank Niklaus
KTH Royal Institute of Technology
SWEDEN

Conor O'Mahony
Tyndall National Institute
IRELAND

Troy Olsson
University of Pennsylvania
USA

Gianluca Piazza
CMU/ECE
USA

Philippe Robert
CEA-LETI
FRANCE

Gabriele Schrag
Technical University of Munich
GERMANY

Debbie Senesky
Stanford University
USA

Boris Stoeber
The University of British Columbia
CANADA

Roozbeh Tabrizian
University of Florida
USA

Yuksel Temiz
IBM Research - Europe
SWITZERLAND

Fei Wang
Southern University of Science and Technology
CHINA

Levent Yobas
Hong Kong University of Science and Technology
HONG KONG

Technical Program Committee

Reza Abdolvand
University of Central Florida
USA

Takashi Abe
Niigata University
JAPAN

Leon Abelmann
University of Twente
NETHERLANDS

Christophe Antoine
Analog Devices Inc.
UK

Mekhail Anwar
University of California, San Francisco
USA

Serhan Ardanuç
Apple
USA

David Arnold
University of Florida
USA

Igor Bargatin
University of Pennsylvania
USA

Skandar Basrour
UGA
FRANCE

Tamara Bechtold
Jade University of Applied Sciences
GERMANY

Holger Becker
microfluidic ChipShop GmbH
GERMANY

Fernando Benito-Lopez
University of the Basque Country
SPAIN

Cristian Cassella
Northeastern University
USA

Hengky Chandrahalim
The U.S. Air Force Institute of Technology
USA

Honglong Chang
Northwestern Polytechnical University
CHINA

Yi Chiu
National Chiao Tung University
TAIWAN

Tao Dong
University of South-Eastern Norway
NORWAY

Kris Dorsey
Smith College
USA

Guo-Hua Feng
Nation Tsing Hua University
TAIWAN

Philip Feng
University of Florida
USA

Maximilian Fleischer
Siemens Energy
GERMANY

Laurent Francis
Université Catholique de Louvain
BELGIUM

Mayur Ghatge
Intel
USA

Mathieu Hautefeuille
Universidad Nacional Autónoma de México
MEXICO

Yun Jung Heo
Kyung Hee University
KOREA

Peter Hesketh
Georgia Institute of Technology
USA

Megan Yi-Ping Ho
The Chinese University of Hong Kong
HONG KONG

Fatih Inci
Bilkent University UNAM
TURKEY

Kornelia Indykiewicz
Wroclaw University of Science and Technology
POLAND

Mehdi Javanmard
Rutgers University
USA

Krishna Jayant
Purdue University
USA

Pierre-Yves Joubert
Paris-Saclay University
FRANCE

Ville Kaajakari
Murata Electronics
FINLAND

Chris Keimel
Menlo Microsystems
USA

Satoshi Konishi
Ritsumeikan University
JAPAN

Giacomo Langfelder
Politecnico di Milano
ITALY

Cuong Phu Le
Norwegian University of Science and Technology
NORWAY

Chung Hoon Lee
Marquette University
USA

Sanghoon Lee
Daegu Gyeongbuk Institute of Science & Technology (DGIST)
KOREA

Thierry Leichle
CNRS
USA

Max Lemme
RWTH Aachen University
GERMANY

Tie Li
SIMIT, CAS
CHINA

Che-Hsin Lin
National Sun Yat-sen University
TAIWAN

Chung-Hsien Lin
TDK
TAIWAN

Huicong Liu
Soochow University
CHINA

Cheng-Yao Lo
National Tsing Hua University
TAIWAN

Ruochen Lu
The University of Texas at Austin
USA

Yuan Luo
Southern University of Science and Technology
CHINA

Michel Maharbiz
UC Berkeley / iota Biosciences, Inc.
USA

Aron Michael
UNSW Sydney
AUSTRALIA

Norihisa Miki
Keio University
JAPAN

Kohji Mitsubayashi
Tokyo Medical and Dental University
JAPAN

Xiaojing Mu
Chongqing University
CHINA

Roger Narayan
NC State University
USA

Eldwin Ng
Institute of Microelectronics
SINGAPORE

Takahito Ono
Tohoku University
JAPAN

Inkyu Park
KAIST
KOREA

Mervi Paulasto-Krockel
Aalto University
FINLAND

Laura Popa
Exponent, Inc.
USA

Robert (Chris) Roberts
The University of Texas at El Paso
USA

Shad Roundy
University of Utah
USA

Tomi Salo
VTT
FINLAND

Silvan Schmid
TU Wien
AUSTRIA

Jeronimo Segovia-Fernandez
Texas Instruments Kilby Labs
USA

Ravi Selvaganapathy
McMaster University
CANADA

Yuji Suzuki
The University of Tokyo
JAPAN

Hidekuni Takao
Kagawa University
JAPAN

Shoji Takeuchi
The University of Tokyo
JAPAN

H. Cumhur Tekin
Izmir Institude of Technology
TURKEY

Hiroshi Toshiyoshi
The University of Tokyo
JAPAN

Toshiyuki Tsuchiya
Kyoto University
JAPAN

Takashiro Tsukamoto
Tohoku University
JAPAN

Guillermo Villanueva
EPFL
SWITZERLAND

Hao Wang
Shenzhen Institutes of Advanced Technology
CHINA

Nan Wang
A*STAR
SINGAPORE

Renyuan Wang
BAE Systems, Inc.
USA

Dana Weinstein
Purdue University
USA

Carolyn White
AMFitzgerald
USA

Jin Xie
Zhejiang University
CHINA

Yoko Yamanishi
Kyushu University
JAPAN

Bin Yang
Shanghai Jiao Tong University
CHINA

Yao-Joe Yang
National Taiwan University
TAIWAN

Ryuji Yokokawa
Kyoto University
JAPAN

Guangya Zhou
National University of Singapore
SINGAPORE

Maryam Ziaei
iSono Health
USA